华为通过皮包公司从台积电骗取约200万片AI芯片Ascend910B,已被台积电发现并停止交付
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https://www.techpowerup.com/333877/huawei-obtained-two-million-ascend-910b-dies-from-tsmc-via-shell-companies-to-circumvent-us-sanctions
https://www.techpowerup.com/333877/huawei-obtained-two-million-ascend-910b-dies-from-tsmc-via-shell-companies-to-circumvent-us-sanctions
According to a recent Center for Strategic and International Studies report, Huawei got its hand on approximately two million Ascend 910B logic dies through shell companies that misled TSMC. This acquisition violates US export controls designed to restrict China's access to advanced semiconductor technology. The report details how Huawei leveraged intermediaries to procure chiplets for its AI accelerators before TSMC discovered the deception and halted shipments. These components are critical for Huawei's AI hardware roadmap, which progressed from the original Ascend 910 (manufactured by TSMC on N7+ until 2020) to the domestically produced Ascend 910B and 910C chips fabricated at SMIC using first and second-generation 7 nm-class technologies, respectively. Huawei reportedly wanted TSMC-made dies because of manufacturing challenges in domestic chip production. The Ascend 910B and 910C reportedly suffer from poor yields, with approximately 25% of units failing during the advanced packaging process that combines compute dies with HBM memory.
Despite these challenges, the performance gap with market-leading solutions still remains but has narrowed considerably, with the Ascend 910C reportedly delivering 60% of NVIDIA H100's performance. Huawei has executed a strategic stockpiling initiative, particularly for high-bandwidth memory components. The company likely acquired substantial HBM inventory between August and December 2024, when restrictions on advanced memory sales to China were announced but not yet implemented. The semiconductor supply chain breach shows that enforcing technology export controls is challenging, and third parties can still purchase silicon for restricted companies. While Huawei continues building AI infrastructure for both internal projects and external customers, manufacturing constraints may limit its ability to scale deployments against competitors with access to more advanced manufacturing processes. Perhaps a future domestic EUV-based silicon manufacturing flow will allow Huawei to gain access to more advanced domestic production, completely circumventing US-imposed restrictions.
15 个评论
这帮猪脑子!高阶芯片只买两万片就行了啊,一个无名的小公司一下买200万片那么多,傻B都知道有猫腻啦!
能不能在卖芯片之前做个背调?或者干脆开个白名单,只有白名单上的可靠公司才能买芯片。
>> 这帮猪脑子!高阶芯片只买两万片就行了啊,一个无名的小公司一下买200万片那么多,傻B都知道有猫...
洞大佐明察!源文中的皮包公司用的复数,文皮包公司无法表达出这个众多的概念,是不是应该把标题改成「数家(或者众多)皮包公司」?
对,中国汉武帝说过,现在不要在意一城一地的得失,要有战略眼光,就是要治他🤣
>> 洞大佐明察!源文中的皮包公司用的复数,文皮包公司无法表达出这个众多的概念,是不是应该把标题改成...
不用,文中英文没有明确加数量词,中文也不用加。比如he ate apples for breakfast翻译成他早餐吃了苹果没有问题。
不排支能行吗?
>> 洞大佐明察!源文中的皮包公司用的复数,文皮包公司无法表达出这个众多的概念,是不是应该把标题改成...
假如是一百家皮包公司,每个皮包公司下两万片订单,这一百张订单除了文件名不同,芯片的布线都一模一样,你说这里面没有鬼,我洞大佐能信你吗?
>> 不用,文中英文没有明确加数量词,中文也不用加。比如he ate apples for brea...
木匠说的对,不过还是觉得讲成「早餐他吃了几个苹果」比较好,(写几个是因为按常理他也不会一次吃200个苹果,不像某挑200斤还不换肩的lv),
>> 假如是一百家皮包公司,每个皮包公司下两万片订单,这一百张订单除了文件名不同,芯片的布线都一模一...
洞主圣明,不过还是要讲一下,比如intel的友商生产同一个型号的显示卡,intel供应的芯片肯定都是一样的,洞大佐指出的布线问题,PCB板不一样的话很正常,核心芯片肯定都是一样的,
建议西方各大公司都严查一下自己是不是有什么部件装在了洼地“自主研发”的复兴号,登月器,六代机上,建议cia学习摩萨德传呼机案例给这些部件加点炸药。
>> 木匠说的对,不过还是觉得讲成「早餐他吃了几个苹果」比较好,(写几个是因为按常理他也不会一次吃2...
同意,因为英语本来就应该说i had some apples for breakfast. 但是因为翻译不应该随便加料,所以如果原文说了shell companies, 但是没有提several, some, a handful of, a limited amount of, quite a lot之类,中文也不应该加上。英文本身表达不严谨,翻译可以指出,但是不应该擅自添加自己的理解,因为我们也不知道是只有两家还是一百家。
只要没有防支那超限战的意识与决心,你一定会输,而且输的彻底